General Description
The Evaluation Board demonstrates the RT6310AGQUF to be designed for a programmed between 0.6V to 5.5V/10A output from a 4.5V to 23V input at 500kHz switching frequency. The RT6310AGQUF provides complete protection functions such as input undervoltage-lockout, output undervoltage protection, overcurrent protection and thermal shut down. Cycle-by-cycle current limit provides protection against shorted outputs and soft-start eliminates input current surge during start-up.
Performance Specification Summary
Summary of the RT6310AGQUF Evaluation Board performance specificiaiton is provided in Table 1. The ambient temperature is 25°C.
Table 1. RT6310AGQUF Evaluation Board Performance Specification Summary
|
Specification
|
Test Conditions
|
Min
|
Typ
|
Max
|
Unit
|
|
Input Voltage Range
|
|
4.5
|
--
|
23
|
V
|
|
Output Current
|
|
0
|
--
|
10
|
A
|
|
Default Output Voltage
|
|
--
|
1.05
|
--
|
V
|
|
Operation Frequency
|
|
--
|
500
|
--
|
kHz
|
|
Output Ripple Voltage
|
IOUT = 10A
|
--
|
11
|
--
|
mVp-p
|
|
Line Regulation
|
IOUT = 10A, VIN = 4.5V to 23V
|
--
|
±1
|
--
|
%
|
|
Load Regulation
|
VIN = 12V, IOUT = 0.001A to 10A
|
--
|
±1
|
--
|
%
|
|
Load Transient Response
|
VOUT = 1.05V , IOUT = 1A to 10A
|
--
|
±5
|
--
|
%
|
|
Maximum Efficiency
|
VIN = 12V, VOUT = 1.05V, IOUT = 2A, VCC_EXT = 5V
|
--
|
91
|
--
|
%
|
Power-up Procedure
Suggestion Required Equipments
- RT6310AGQUF Evaluation Board
- DC power supply capable of at least 25V and 6A
- Electronic load capable of 10A
- Function Generator
- Oscilloscope
Quick Start Procedures
The Evaluation Board is fully assembled and tested. Follow the steps below to verify board operation. Do not turn on supplies until all connections are made. When measuring the output voltage ripple, care must be taken to avoid a long ground lead on the oscilloscope probe. Measure the output voltage ripple by touching the probe tip and ground ring directly across the last output capacitor.
Proper measurement equipment setup and follow the procedure below.
1) With power off, connect the input power supply to the VIN and GND pins.
2) With power off, connect the electronic load between the VOUT and nearest GND pins.
3) Turn on the power supply at the input. Make sure that the input voltage does not exceeds 23V on the Evaluation Board.
4) Check for the proper output voltage using a voltmeter.
5) Once the proper output voltage is established, adjust the load within the operating ranges and observe the output voltage regulation, ripple voltage, efficiency and other performance.
Detailed Description of Hardware
Headers Description and Placement
Carefully inspect all the components used in the EVB according to the following Bill of Materials table, and then make sure all the components are undamaged and correctly installed. If there is any missing or damaged component, which may occur during transportation, please contact our distributors or e-mail us at evb_service@richtek.com.
Test Points
The EVB is provided with the test points and pin names listed in the table below.
|
Test Point/
Pin Name
|
Function
|
|
VIN
|
Input voltage.
|
|
VOUT
|
Output voltage.
|
|
GND
|
Ground.
|
|
EN
|
Enable and operation mode control input.
|
|
VCC_EXT
|
External voltage input for VCC.
|
|
VCC
|
Internal LDO output. Used as supply to internal control circuits. DO NOT connect to any external loads.
|
|
ILMT
|
Valley current-limit setting pin.
13A: Connect the ILMT pin to PGND.
15A: Leave the ILMT pin floating/open.
17A: Connect the ILMT pin to 5V.
|
|
JP11
|
ILMT jumper. Connect ILMT to VCC,GND or floating.
|
|
LX
|
Switch node test point.
|
|
PG
|
Power good indicator.
|
|
BS
|
Bootstrap test pin.
|
|
JP3
|
VOUT ripple measure test pin.
|
Bill of Materials
|
VIN = 12V, VOUT = 1.05V, IOUT = 10A, fSW = 500kHz
|
|
Reference
|
Count
|
Part Number
|
Value
|
Description
|
Package
|
Manufacturer
|
|
U1
|
1
|
RT6310A
|
RT6310AGQUF
|
Buck Converter
|
UQFN-23L 3x3 (FC)
|
RICHTEK
|
|
C3
|
1
|
0603N680J500CT
|
68pF
|
Capacitor, Ceramic, 50V, NPO
|
0603
|
WALSN
|
|
C4, C5, C6, C7, C8, C9
|
6
|
0805X226M6R3CT
|
22µF
|
Capacitor, Ceramic, 6.3V, X5R
|
0805
|
WALSN
|
|
C18, C41
|
2
|
0603B104K500CT
|
0.1µF
|
Capacitor, Ceramic, 50V, X7R
|
0603
|
WALSN
|
|
C22, C23
|
2
|
0805X106K250CT
|
10µF
|
Capacitor, Ceramic, 25V, X5R
|
0805
|
WALSN
|
|
C28
|
1
|
0603X475K6R3CT
|
4.7µF
|
Capacitor, Ceramic, 6.3V, X5R
|
0603
|
WALSN
|
|
C40
|
1
|
0603X475K6R3CT
|
4.7µF
|
Capacitor, Ceramic, 6.3V, X5R
|
0603
|
WALSN
|
|
L1
|
1
|
PEUE063T-R68MS
|
0.68µH
|
Inductor, Isat = 18.5A, 4.3mΩ
|
7.3x6.8x3mm
|
CYNTEC
|
|
R1
|
1
|
RTT033092FTP
|
30.9k
|
Resistor, Chip, 1/10W, 1%
|
0603
|
RALEC
|
|
R2
|
1
|
WR06X4122FTL
|
41.2k
|
Resistor, Chip, 1/10W, 1%
|
0603
|
WALSIN
|
|
R4, R6, R9, R10, R11
|
5
|
WR06X000 PTL
|
0
|
Resistor, Chip, 1/10W, 1%
|
0603
|
WALSIN
|
|
R8
|
1
|
WR06X1003FTL
|
100k
|
Resistor, Chip, 1/10W, 1%
|
0603
|
WALSIN
|
|
R17
|
1
|
WR06W1R10FTL
|
1.1
|
Resistor, Chip, 1/10W, 1%
|
0603
|
WALSIN
|
Typical Applications
EVB Schematic Diagram
1. The capacitance values of the input and output capacitors will influence the input and output voltage ripple.
2. MLCC capacitors have degrading capacitance at DC bias voltage, and especially smaller size MLCC capacitors will have much lower capacitance.
Measure Result
|
Load Transient Response
|
Power On from EN/MODE
|
|
|
|
|
Power Off from EN
|
Overcurrent Limit
|
|
|
|
|
VOUT UVP
|
VOUT OVP
|
|
|
|
|
Efficiency vs. Output Current
|
Switching Frequency vs. Output Current
|
|
|
|
|
Output Voltage vs. Output Current
|
Quiescent Current vs. Input Voltage
|
|
|
|
|
Thermal Image at VIN = 19V, VOUT = 1.05V, IOUT = 10A
|
|
|
Note: When measuring the input or output voltage ripple, care must be taken to avoid a long ground lead on the oscilloscope probe. Measure the output voltage ripple by touching the probe tip directly across the output capacitor.
Evaluation Board Layout
Figure 1 to Figure 4 are RT6310AGQUF Evaluation Board layout. This board size is 90mm x 70mm and is constructed on four-layer PCB, outer layers with 2 oz. Cu and inner layers with 1 oz. Cu.
Figure 1. Top View (1st layer)
Figure 2. PCB Layout—Inner Side (2nd Layer)
Figure 3. PCB Layout—Inner Side (3rd Layer)
Figure 4. Bottom View (4th Layer)